The Effects of Voltage, Resistance, and Time Allowed to React on the Mass of Copper Gained in Electroplating

In an electrolyte solution of copper (II) sulfate and sulfuric acid we emerged two pieces of copper attached to a power source. We then switched on the power source and allowed electrons to move through the system, thereby removing copper from the anode and transferring the copper to the cathode. We chose this area of copper plating because metal plating is useful in many capacities of industry and is used extensively in minting coins.

Research Done By:

Noah Dahn
New Haven

Alex Moase